1. Wire dia selection is made based on current carrying capacity(thick
wire can carry more current for burn-out) , bond strength(mold pressure
and transfer speed) and wire length. e.g. 1.25 mil wire is more often
used where wire length is more than 120 mils(to control wire sweep or
sag as case may be)
2. 1-3% wire is more stiff as compared to 2-4%. 2-4% will have more
sagging for long wires if loop-back(reverse motion) is not used.


> ----------
> From:         Mike Coleman[SMTP:[log in to unmask]]
> Sent:         April 2, 1998 9:45 AM
> To:   [log in to unmask]
> Subject:      [TN] Wire bonding
>
> I'm looking for information on the advantages/disadvantages of two
> things:
> 1.      1 mil gold wire and 1.25 mil gold wire
> 2.      1-3% elongation or 2-4% elongation
>
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