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April 1998

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Subject:
soldering with high temp. preforms-reducing atmosphere
From:
Ed Holton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 23 Apr 1998 11:39:49 -0400
Content-Type:
text/plain
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text/plain (27 lines) 
Looking for information about using a reducing atmosphere (or forming gas)
of nitrogen and hydrogen when soldering.  I just learned about this during
some related research.  In this application, a die is soldered to a
terminal using an 88%Pb solder preform (reflow 300C)  The comment was made
that this application could be done without flux by using a reducing
atmosphere of nitrogen and hydrogen, where at the high temperature (350C)
the hydrogen will "clean" the surface.  I am interested in any information
on this subject.

Thank You

Ed Holton
Hella Electronics
734-414-0994

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