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April 1998

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Subject:
Re: Ni plating and Immersion Au
From:
Hütter Simon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 23 Apr 1998 14:54:27 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines) 
Werner wrote:
>... I do not know where the notion
>of "Cu diffuses into the Au" or that"Ni acts as a barrier layer to
prevent the
>formation of CuAu intermetallics" comes from, but that is not the case...

Werner,
You are right with your other conclusions, but the Ni works
also as a barrier to prevent the diffusion of Cu into Au.
We have a customer who wants only a flash Au over Cu. After a month the
Au is disapeared.

Simon Huetter
R&D Engineer
Optiprint, Switzerland

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