Our design group have asked me if they could use an FBGA memory device. The device is a 6X8
matrix with balls on .8mm centers. The ball diameters is .4mm. Can anyone help with PWB layout
and how to process in manufacturing. We are currently use 1.27mm pitch BGAs with 357 balls. I
would appreciate any answers that I can get on the following:

1. Pad sizes.
2. Are there layout issues with traces and vias.
3. Are there issues with screen printing using polymer blades.
4. What type of stencil technology should I use.
5. What size aperture opening and thickness of the foil.
6. Should blind vias be used instead of conventional vias.
7. Is there certain areas on a PWB the FBGA should be located in. (e.g.. near supported edges
verses the middle)
8. Any other helpful information.

Thank you for any help you can provide. I would also like to know if you are currently using this
type of part in any quantity.

Ron Mowbray
Paradyne Corporation
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