TECHNET Archives

April 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Brad Vanderhoof <[log in to unmask]>
Reply To:
Date:
Wed, 22 Apr 1998 09:35:24 PDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (38 lines)
The Ni acts as a barrier layer to prevent the formation of CuAu intermetallics.

-----Original Message-----
From:   Scott M. Severson [SMTP:[log in to unmask]]
Sent:   Wednesday, April 22, 1998 9:47 AM
To:     [log in to unmask]
Subject:        [TN] Ni plating and Immersion Au

Why is nickel plating used with immersion gold processes when copper could
provide a solderable surface under the gold?

Thanks
Scott Severson
Benchmark Electronics Inc.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2