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April 1998

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Subject:
Re: Ni plating and Immersion Au
From:
"Chan, Marcelo" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Apr 1998 12:07:35 -0400
Content-Type:
text/plain
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text/plain (48 lines) 
Cu diffuses into the Au layer readily,especially since Immersion Au is more
porous than other types... oxidation of this metal compound is extremely
difficult to remove suing standard soldering practices...Ni acts as a barrier
layer ...

Marcelo

        -----Original Message-----
        From:   Scott M. Severson [SMTP:[log in to unmask]]
        Sent:   Wednesday, April 22, 1998 12:47 PM
        To:     [log in to unmask]
        Subject:        [TN] Ni plating and Immersion Au

        Why is nickel plating used with immersion gold processes when copper
could
        provide a solderable surface under the gold?

        Thanks
        Scott Severson
        Benchmark Electronics Inc.

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