Can anyone describe to me how they would do such a PWB in terms of processing
order and PWB finish selection?

The application is RF and perhaps higher frequencies, which means that we may
use materials ranging from Arlon 25N, rogers 4003 all the way to the traditional
Rogers 6002..few layers...ratio of solderable pads to bondable is about 7 to 1
with about 100 pads on the whole board...1 by 1.5" in size...

Are immersion Au, electrolytic Au, fused solder or  Hasl viable options?


thanks,

Marcelo

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