Graham,

Those suppliers of our who make Al backed teflon boards do not strip the
zincate prior to E/L Ni.  A strong caustic cleaner should activate the
aluminum surface.  Back in a stone aged past life, we stripped anodized
aluminum using strong caustic.

Regards,
Dave Sullivan
Rockwell Collins




[log in to unmask] on 04/21/98 08:31:59 PM

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Subject:  [TN] Copper/Aluminium Clad Teflon Plating




Copper/Aluminium clad Teflon Plating
Specifically, my query concerns plating 0.5oz to 1oz copper on Teflon
with 1/8 to 1/4 Aluminium back (6061).
What is the best method of activating the Aluminium surface prior to
plating without using a nitric desmut, as this attacks the copper
surface.
or
What can be used for removing the smut on the Aluminium surface after
etching in a potassium fluoride etch which will not attack the copper
surface.
How can I achieve maximum adhesion of electroless nickel on Aluminium,
such as double dipping in Zincate. without stripping the Zincate with
Nitric
Thanks in advance
Graham Savage
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