Werner -
The German study you cited sounds interesting. I assume that the higher
reliability for off-of-center (with respect to the pad) placement was with
regard to chip components only. The study done by AMP a number of years ago
with the gull-wing and butt-joint leads on ICs showing reliability was
optimized with center of pad(s) location.
Look forward to your comments.
Regards,
Phil Zarrow
ITM, Inc.
Durham, NH
USA
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