Charles Barker@I-O INC
04/21/98 11:56 AM

This is related to Charles Elliot's question about reliability of big
disctetes.

Does anyone have any experience with SO-14 sized ceramic leadless devices
attached to FR-4?
The boards go through standard convection reflow of primary side (this is
where the SO-14's are).
Then glue cure for bottom side discretes at 150 deg C.
Then there is wave solder for soldering bottom discretes and through hole
parts.
Completed chassis assemblies are subjected to ESS from -55 deg C to +85 deg
C for several days.
Our products are used in the field all over the whole globe. That subjects
them to varying ranges of temp cycling on a daily basis.

Any negative or positive experiences out there?

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################