>      2) Since I haven't obtained my copy of IPC-2222 yet, will someone tell
>         me if the wording from IPC-D-275 (Paragraph 5.3.2.5 Nonfunctional
>         Lands) has been changed in IPC-2222?

Quoted from IPC-2222:

9.1.4 Nonfunctional lands.  Nonfunctional lands should be included on
internal layers for all platd-through holes. Nonfunctional lands need
not be used where electrical clearance requirements do not permit,
such as ground planes, voltage planes and thermal planes.  For high
layer count boards, greater than 10 layers, it is recommended to
remove some of the nonfunctional lands in the vertical stack.
Plated-through holes passing through internal conductive planes
(ground, voltage, etc) and thermal planes shall meet the same minimum
spacing requirements as conductors on internal layers, and should
meet the minimum spacing requirements of Figure 9.2.

Obviously I can't include this drawing.  Looks like you need to order
your own copy of IPC-2222.  I assume faxing a copy of this page to
Mr. Wolf is a copyright violation?  If not, would someone let me
know?  Please?

Hope I helped a little.

JoAnn L. Amerson
Design Librarian
Red Lion Controls, Inc.
E-mail: [log in to unmask]
Voice: (717) 767-6961 ext 6308

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