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April 1998

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Subject:
Re: Ni/Au
From:
"Chan, Marcelo" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Apr 1998 14:13:10 -0400
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Shadow plating is caused when the laminate material reacts with the catalyst and
forms and insoluble Pd compound that contaminates the EN bath... this is
according to RD chemical.... I have personally seen this on high density PWBs
with the caplayer being adhesiveless PI for microvia reasons.... As I had no
other explannation, I have accepted it as so for now...

Marcelo


        -----Original Message-----
        From:   Mike Bailey [SMTP:[log in to unmask]]
        Sent:   Thursday, April 16, 1998 10:16 AM
        To:     [log in to unmask]
        Subject:        [TN] Ni/Au

        Several weeks ago,  I recall seeing a message posted regarding the
        propensity of immersion Ni/Au to "Shadow Plate",  particularly on high
Tg
        laminates.  Does anyone remember the originator or recall any of the
        responses that might substantiate this?

        Thanks

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