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Subject:	Re: increased reliability of solder joints due
From:	JPClech <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Mon, 20 Apr 1998 10:53:03 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (44 lines)

In a message dated 98-04-20 10:29:36 EDT, you write:
<< Does anyone have any information, data or references regarding increased
reliability of solder joints due to the use of conformal coatings?  >>

Alan,
Check out the following papers:
1) Nicewarner, E., "Effect of solder joint geometry and conformal coating on
surface mount solder joint fatigue life", Proceedings, Nepcon East '93,
Boston, MA., June 15-17, 1993, pp. 207-216.
2) Nicewarner, E., "Historical failure distribution and significant factors
affecting surface mount solder joint fatigue life", Proceedings IEPS'93, San
Diego, CA, September 12-15, 1993, pp. 553-563.
3) Nicewarner, E., "Historical failure distribution and significant factors
affecting surface mount solder joint fatigue life", Soldering and Surface
Mount Technology, No. 17, May 1994, pp. 22-29.
4)Tong, H. M., Mok, L., Grebe, K. R. and Yeh, H. L., "Parylene encapsulation
of ceramic packages for liquid nitrogen application", Proceedings, 40th
Electronic Components and technology Conference, Las Vegas, NV, May 11-13,
1990, Vol. 1, pp. 345-350.

Earl Nicewarner's thermal cycling results (between 0 and 100C) gave a 2.8X
life improvement for solder joints of parylene-coated LCCC assemblies. I'd be
interested in the reference to the IVF work that you mentionned.

Jean-Paul
________________________________________________
Jean-Paul Clech
EPSI Inc., P. O. Box 1522, Montclair, NJ 07042
SMT / BGA / Flip chip / CSP reliability specialists
tel: (973)746-3796, fax: (973)655-0815
home page: http://members.aol.com/Epsiinc1/index.html

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