Eddie,
As far as the AlphaLevel surface finish goes, I have had a couple of
opportunities to evaluate its performance for some of our customers. In
solderability testing, the AlphaLevel did pretty good at keeping up with
HASL, but HASL did do better. I have also processed assemblies with this
finish and I have had no trouble at all. I could be I was using the right
flux for the surface finish. I have heard the stories about some folks
having trouble processing it with there favorite flux, but with all change
comes some pain.
As far as the reliability, we did a study some time back, where
AlphaLevel's impact on reliability was compared to HASL. Same boards,
components, processing, handling, as well as everything else right down the
line. After we were done beating the boards through thermal cycling, we
couldn't tell any real difference between the AlphaLevel population and the
HASL populations.
If you have any questions on how we conducted this study, feel free to
contact me off line.
John Guy
ACI / EMPF
714 N. Senate Ave.
Indianapolis, IN 46202-3112
voice: (317) 655-EMPF ext.130
fax: (317) 655-3699
e-mail: [log in to unmask]
-----Original Message-----
From: Eddie Brunker [SMTP:[log in to unmask]]
Sent: Monday, April 20, 1998 3:09 AM
To: [log in to unmask]
Subject: Re: [TN] CALL FOR PAPERS: IPC 1998 Surface Finishes Conference
At 18:23 18/04/98 +1000, you wrote:
>Ed ,
>If you have to assemble, switch, contact, not oxidize (as some), stay
>level (helps) ; all on one board ; you have little choice ; but try
>harder .
May I ask you for more details on these points. Particularly switch and
contact.
>Crack your mobile open and start the education .
I don't consider mobile phones to be complex assemblies and see no
advantage
to using alternatives, other than situations where direct contact without
solder is required.
>We all love HASL as much as you do . But ..........
>If you do straight solder only , try the new AlphaLevel , it solders
>almost as well .
What about the long term reliability of a silver based product? What about
the difficulty the fabricators have getting the chemistry to work, and
again
from their point of view the problems associated with a silver based
technology.
Regards,
>See you paul
>
>
>>----------
>>From: Eddie Brunker[SMTP:[log in to unmask]]
>>Sent: Friday, 17 April 1998 21:40
>>To: [log in to unmask]
>>Subject: Re: [TN] CALL FOR PAPERS: IPC 1998 Surface Finishes
Conference
>>
>>At 21:46 16/04/98 -0500, you wrote:
>>>
>>>
>>>
>>>
>>>Hi TechNet -
>>>
>> HASL finishes are quite
>>>robust in many assembly operations but can be equally non-robust in
other
>>>assembly operations.
>>
>>It would be useful to have a discussion on the specific situations where
>>this is the case.
>>
>>
>>In addition there are a number of IPC committees (e.g.
>>>ANSIJ-STD-002/003, and the Alternative Solderable Finishes task group)
that
>>>have an active interest in the latest developments in the alternative
>>>finishes activities.
>>
>>I agree that we must look to the future. But why look for complex answers
>>when simple ones already exist.
>>
>>As stated earlier, education may hold the key, but that's not as exciting
or
>>glamorous as a new PCB finish.
>>
>>
>>>
>>>Dave Hillman
>>>Rockwell Collins
>>>[log in to unmask]
>>>
>>>
>>
>>P.S. Again, please excuse any illmannered ranting and raving on my part
>>earlier.
>>
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