Ed ,
not everybody is so lucky to be able to stick with HASL .
We all don't particularly crave on the "glamour" of the solderability of
the alternative finishes ; because there is none .
The complexity of the design usually forces you to fairly desperate
solutions as NiAu is just one example .
If you have to assemble, switch, contact, not oxidize (as some), stay
level (helps) ; all on one board ; you have little choice ; but try
harder .
Crack your mobile open and start the education .
Besides that , you are quite right , HASL is expensive, poisonous, hot,
energy hungry, dangerous, bumpy process .
We all love HASL as much as you do . But ..........
If you do straight solder only , try the new AlphaLevel , it solders
almost as well .
See you paul
>----------
>From: Eddie Brunker[SMTP:[log in to unmask]]
>Sent: Friday, 17 April 1998 21:40
>To: [log in to unmask]
>Subject: Re: [TN] CALL FOR PAPERS: IPC 1998 Surface Finishes Conference
>
>At 21:46 16/04/98 -0500, you wrote:
>>
>>
>>
>>
>>Hi TechNet -
>>
> HASL finishes are quite
>>robust in many assembly operations but can be equally non-robust in other
>>assembly operations.
>
>It would be useful to have a discussion on the specific situations where
>this is the case.
>
>
>In addition there are a number of IPC committees (e.g.
>>ANSIJ-STD-002/003, and the Alternative Solderable Finishes task group) that
>>have an active interest in the latest developments in the alternative
>>finishes activities.
>
>I agree that we must look to the future. But why look for complex answers
>when simple ones already exist.
>
>As stated earlier, education may hold the key, but that's not as exciting or
>glamorous as a new PCB finish.
>
>
>>
>>Dave Hillman
>>Rockwell Collins
>>[log in to unmask]
>>
>>
>
>P.S. Again, please excuse any illmannered ranting and raving on my part
>earlier.
>
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