TECHNET Archives

April 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Phil Culpovich <[log in to unmask]>
Reply To:
Date:
Sun, 19 Apr 1998 00:08:30 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines)
Jorge:

Is there a paticular reason you want to regenerate with H2O2? Using sodium chlorate is becoming far
more common due to its much lower cost and far greater safety record. If you would like to contact
me directly by e-mail for a few alternatives, send an e-mail to: [log in to unmask] and I
will be happy to discuss this topic with you.

Phil Culpovich

> Date:    Fri, 17 Apr 1998 22:30:29 PDT
> From:    jorge martinez <[log in to unmask]>
> Subject: Cupric etching with H2O2
>
> can you please give me any source of info about Cupric etching with
> Hydrogen peroxide? I mean any book with "complete" information because
> online info is nonexistentor at least I have not found it.
>
> Thank you for your help
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2