Emily E Hoffman wrote:

>         SMTA/IMAPS EXPO 98 - DALLAS
>      Technical Symposium and Exhibition
>             April 27-28, 1998
>
> Plano Convention Center
>       2000 E. Spring Creek Parkway
>       Plano, TX (Just East of 75)
>
> EXHIBITS:  APRIL 28, 11:00 AM TO 6:00 PM
> FREE & OPEN TO ALL WHO REGISTER
> (Registration form at end of e-mail)
>
> KEYNOTE ADDRESS:   April 28  12:00
>   "Trends in High Pin-Count Device Packaging"
>   presented by Jan Vardaman of Techsearch International Inc.
>
> FREE SMTA TECHNICAL SESSIONS   April 28
> Technical Sessions:  8:30-11:30    &  1:30-3:30
> 8:30am  Design for Manufacturing a Global Manufacturing Solution
>         Lease  vs Purchase Analysis
>         Outsourcing versus Buy
>         Managing Moisture Sensitive SMT Components
> 1:30pm  An Awareness of ESD
>         Design for Ergonomics
>         SPC in the SMT Environment
>         Ball Grid Array Rework and Repair
>
> FREE IMAPS TECHNICAL SESSIONS:   April 28
> 8:30-9:00am  "Solder Bumping in Inert Atmosphere"
> 9:00-12am  Wafer/Die Bumping paper & panel discussion
> 1:30-3pm   Wafer/Die Placement, Inspection & test panel discussion
> 1:30-5pm   Wireless Technologies
>
> *** OVER 70 EXHIBIT TABLES IN THE ELECTRONICS MFG BUSINESS ***
>       FREE TO ATTENDEES
>    1:00 AM  -  6:00  PM  April 28 Only
>
> *** DOOR PRIZES ***
>
> *** COMPLIMENTARY REFRESHMENTS ***
>
> REGISTER BY APRIL 21th for the Courses, Technical Sessions or Exhibits to be
> entered into a DRAWING for a FREE 3COM Professional PALM PILOT.
>
> ===============================================================
> Co-sponsored by the North Texas Chapters of:
>            The Surface Mount Technology Association (SMTA)
>                              and
>   The International Microelectronics and Packaging Society
>   (IMAPS formerly ISHM & IEPS)
>
> ===============================================================
> 1998 EXPO Exhibitors (as of early April 1998)
>
> Acudata
> Advanced Ceramics
> Axcess Technologies, LLP
> Brady USA, Inc.
> Circuit Design Specialties, Inc.
> Circuit Technology Inc.
> Coors Ceramics Company
> Copelco Capital
> D.G. Marketing
> DeForest Sales Company
> Dossett Industrial Sales
> DuPont Electronics
> Eastern Smelting & Refining Corp.
> Ed Wuermser Associates
> Epoxy Technology
> Fine Line Stencil
> Gannon & Scott, Inc.
> Indium Corp. of America
> Interfet
> Leeds Instruments
> Merino Sales Company
> Nove reps, Inc.
> PAC
> PPI Adhesive Products Corp.
> Prime Distributing Company
> Process Sciences, Inc.
> PSI International
> Quadtek
> Raytheon Company Adv. Mult. Inter.
> Scientific Sealing Technology
> SMEC. Inc.
> Sonoscan, Inc.
> Specialty Bags Corporation
> Specialty Photo-Etch, Inc.
> Spectra Sales Corporation
> Speedy Circuits
> Southwest Systems Technology
> Teamco Factory Automation Systems
> Teledyne Microelectronics
> Texsource
> Thinking Productivity, Inc.
> Torenko & Associates
> Unicircuit
> V-Tek, Inc.
> W.L. Gore & Associates
> Westak
> Williams Advanced Materials
> Zuken-Redac
>
> For more information see http://www.smta.org
>
> *Attendee Registration Form*
>
> To register, please fill out the form below completely and mail to:
>
> Michelle Dossett
> Ceramic Solutions
> 229 Seegers Drive
> Arlington,  TX  76018
>
> or fax to:
>
> Gary Tanel
> Raytheon Systems Company
> fax (972) 462-2140            voice (972) 462-2240
>
> Name:   _____________________________________________________________
>
> Company:   ________________________________   Title:   ___________________
>
> Address:  ____________________________________________________________
>
> City:  _______________________________  State:  _______  Zip: ______________
>
> Phone:   _____________   Fax:  ______________  e-mail: ________________
>
> Affiliation:       ___  IMAPS        ____ SMTA       ___ IEEE
>
> Are you interested in becoming an IMAPS member?  _______  SMTA member?
>
> I would like to register for:
>
> ____  Free IMAPS Technical Sessions
>
> ____  Free SMTA Technical Sessions
>
> ____  Free Exhibits
>
> Enclose a fee for the Personal development courses only.
>  ___  PD1 - FUNDAMENTALS OF MICROELECTRONICS $250.00,
> $30 Full Time Student, CEU Credit, A. Elshabini, PHD
> April 27, 1:00 PM  --  5:00 PM
>
> ___ PD2 - CHIP TECHNOLOGY, BALL GRID ARRAY AND CHIP SCALE PACKAGING FOR HIGH
> DENSITY AND MINIATURIZED ELECTRONICS $250.00, $30 Full Time Student, CEU
> Credit, A. Elshabini, PHD
> April 27, 6:00 PM -  9:00 PM
>
> __  PD3 - MULTICHIP MODULE TECHNOLOGIES AND
> ADVANCED ELECTRONICS PACKAGING $250.00, $30 Full Time Student, CEU Credit, A.
> Elshabini, PHD
> April 28, 8:00  --  12:00 NOON
>
> Contact Emily Hoffman at [log in to unmask] for removal from this list.

Technical Symposium and Exhibition     SMTA/IMAPS EXPO 98 - DALLAS
        April 27-28, 1998

Plano Convention Center
      2000 E. Spring Creek Parkway
      Plano, TX (Just East of 75)

SMT Abstracts
(registration information for FREE technicals sessions in prior e-mail)

KEYNOTE ADDRESS:   April 28  12:00
  "Trends in High Pin-Count Device Packaging"
  presented by Jan Vardaman of Techsearch International Inc.

FREE SMTA TECHNICAL SESSIONS   April 28   See abstracts below
Technical Sessions:  8:30-11:30    &  1:30-3:30
8:30am  Design for Manufacturing a Global Manufacturing Solution
        Lease  vs Purchase Analysis
        Outsourcing versus Buy
        Managing Moisture Sensitive SMT Components
1:30pm  An Awareness of ESD
        Design for Ergonomics
        SPC in the SMT Environment
        Ball Grid Array Rework and Repair


ABSTRACTS
The following are the summary for the SMTA sessions:

Morning Session: 08:30 AM - 11:30 AM

1. Design for Manufacturing a Global Manufacturing Solution by Frank Henry
and Cynthia Sutherland, DSC Communications.

Organizations that embrace strategies of DFM reap the benefits of cost, cycle
time and improved product quality. However, standard methods of implementing
DFM are complicated.  Gaining the confidence of the design community  and
executing to project needs is an important aspect. Establishing tools  and
strategies to enhance  information flow and training are also key to the
success of the program. This presentation will discuss the various tools and
strategies  required for a global manufacturing solution.

2. Lease  vs Purchase Analysis by Al Hosack, Copelco

This presentation is aimed at  determining in which cases leasing will be most
efficient method of acquiring your electronic manufacturing equipment. Topics
will be discussed in simple laymen terms and include: When leasing makes
economic sense, what types of lease programs are offered in the market,
understanding the finance terms like return-on-equity, residual value,
operating lease, capital lease  etc.

3.  Successful Outsourcing - panel discussion by Tom Moe, Second
Source

This discussion is for anyone exploring the outsourcing of assembly  as
well as small contractors who work with customers to develop board level
specifications. Successful outsourcing requires significant planning, as
well as communication of appropriate OEM resources to obtain high yield
at minimum costs. By implementing a few simple checks and
specifications, both small and large companies can compete very
successfully. The session will be a primer, using a basic checklist
approach enabling your company to enter the outsourcing frenzy without
succumbing to the pitfalls of being dependent upon your vendor to, make
your decisions, which is often the ticket for mediocre results.

4. Managing Moisture Sensitive SMT Components - Rene Totten, Alcatel Network
Systems

Many plastic components may be damaged by entrapped moisture during reflow
process. Prevention of moisture-related component damage will involve design,
purchasing, stocking, and assembly operations. this presentation will  discuss
the nature of moisture sensitivity, and recommended procedures to be used
throughout the organization

Afternoon Session: 01:30 PM - 05:00 PM

5.  An Awareness of ESD, Dean Crews, Raytheon Systems Co.,

This paper is designed to review and emphasize the basics of electrostatic
discharge. With reference from EIA-625 we will explore ESD packaging and
handling requirements. How training enhances the correct attitude for handling
and protecting ESDS parts and assemblies will be discussed. We will be using
real life scenarios to discuss what role ESD audit performs for the
manufacturing area.

6.  Design for Ergonomics,  Rick Cruise and Roger Frazier, Raytheon Learning
Institute

In this paper will be presented  the important factors why ergonomic design
principles should  be included early in the concept development cycle and
continue ergonomic evaluations of the design in the prototyping cycle. The
benefits that will be noted during the manufacture and assembly  will be
discussed.

7.  SPC in the SMT Environment, Robert Davis

Controlling SMT, Wave Solder, Auto/Hand insert, and hardware placement can be
controlled by numerous methods. We will discuss methods  appropriate for these
applications: x-bar charts, DOE, work instructions, FMEA, or traditional Lean
Thinking techniques. Application of these various techniques and the benefits
derived with respect to time and employee acceptance will be discussed.
Included in the presentation will be suggestions for functional
responsibilities in these applications.

8. Ball Grid Array Rework and Repair - Martin Roberts,  PAC

Rework and repair is an integral part of circuit card assembly. This paper
addresses the BGA package removal and installation methodologies with emphasis
on PWB and package, site preparation, and potential problems associated with
the rework and repair processes.





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