Hello Technetters!

FYI -

The IMAPS and SMTA chapters in the Chicago area are holding a conjoined
Symposium and Tabletop Vendor Day at Northern Illinois University on
April 29th.

If you need more information or would like to register, please contact
Nancy Ondera at NIU (TEL:  815-753-6902, FAX:  815-753-4203)

****NOTE:  Please do not contact me with questions because I will be out
all next week and won't be able to help you.

Papers being presented include:

- Surface Mount Microchip Tantalum Capacitors, High Capacity, Very Small
Size
- Improved Adhesion of Thick Film Conductors
- Fabrication of Low Cost Microwave Circuits and Structures Using
Advanced Thick Film Technology
- Practical Wire Bonding for Microsensor Manufacturing
Benefits and Misconceptions of Wire PUll Testing of Wedge Bonds
- A Guide to Through Hole Printing
- Electronic Packaging Solutions enabled by Powder Metal-Matrix
Composites
- Lasers for Micorelectronics Today and into the New Millenium
- Practical Design Issues to Bump and Flip Technology
- Comprehensive Solder Mask Evaluation for Surface Mount and Wave Solder
Applications
- Plastic SMS Package Technology for Accelerometers
- New Developments in Lead-Free Soldering for SMT Applications
- Reflow/No-Flow Encapsulants for Flip Chip Technology
- Use of Microwave for Quick Curing of Encapsulants
- Advanced IC Encapsulation and Underfill Using Closed-Loop Linear Pump
Technology
- New Electromechanical Interconnection Technology
- Crucial Element in Configuration of Wave Solder for Water Based,
No-Clean Flux Application

See you there!
Enza

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