I plan to design a multichip module which contains 1 chip with about
200 pads and 2 chips with about 50 pads, no other components.The
whole module shall replace as intermediate solution a single chip CPU
in QFP208. Thus, the MCM itself must have the outline of a QFP208,
too. For cost reasons, it will probably be a MCM-L, a thin multilayer
on FR5 material. The chips will be wedge-wedge Al wire bonded, then
globe top. It is planned to produce 2000 modules in lots of about
100.

Does anybody know a low cost solution for getting the fine pitch
pins around this MCM? That means, no customer specific lead frames
etc. The only _medium_ cost solution I found were the solder and flux
bearing leads series CG33AA from NAS Interplex, which would have tool
costs of about $ 8000 + material. Does anybody have experiences with
these parts or know any other solutions / suppliers?

Many thanx in advance, regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Leiterplattenlayout, Bestueckung
Am Langhoelzl 11, D-85540 Haar
Postfach 1143, D-85529 Haar
Tel.: 089/4620 0937, Fax: 089/4620 0938
E-Mail: [log in to unmask]
Internet: http://home.t-online.de/home/matthias.mansfeld

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