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April 1998

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Subject:
Re: NiAu Plating Problem
From:
RGergory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Apr 1998 16:07:37 EDT
Content-Type:
text/plain
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text/plain (27 lines) 
Frank,

Send the boards back to your supplier!!!
Lead is used as a stabiliser in Electroless Nickel baths but in the ppm
range!!

From your description it sounds like you have a problem with ENi becoming
passive - oxidising prior to gold application. This will give you the black
appearance and peeling gold. Too thin a gold may also be a problem which is
porous and allowed the Nickel to oxidise.
In short - at the very least do a solderability check and send them back!!

Russell
Atotech UK

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