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April 1998

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Subject:
From:
Steven Yen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Apr 1998 09:18:37 -0700
Content-Type:
text/plain
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text/plain (53 lines)
Do horizontal cross sections;

1.  Extract an area that has multiple holes. get 2 samples.
2.  Pending on your mounts, the larger the area extracted the
better. ex. 1.5"  x  1.5".
3.  Cold mount and grind down at a very slight angle so each layer
is exposed. You need to have 2 separate mounts with the 1st one
top side down so you can grind down from layer 1 down to
several layers and the other mount bottom side down.
4. If the grinding is done correctly, you can exactly get just
"before" the copper is touched, i.e. still have some glass
remaining. This is critical especially if someone challenge you that
you grinded away the problem.

Steven Yen

>>> BOB HAYNES <[log in to unmask]> 04/17/98
06:50am >>>
This question is in regard to inspection of internal annual ring.
IPC
6012 Para. 3.4.2 allows breakout. When coupon F and/or X-ray
techniques are not to be utialized and microsection is only option.
How do you evaluate breakout?

Thanks in advance for any suggestions.

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