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April 1998

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Subject:
From:
John Waite <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Apr 1998 12:03:41 -0400
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Good Day Bob,
    Based on your posting, you want to cross section something other than designed coupons (in
this case?).   You will need to cross section an actual board (unless you have the panel frames
with some type of alternate coupon.  You will need to take 2 sections from each corner (1-x and
1-Y) for any layers that exhibit holes in pads.  If you do not have pads on all layers (I.E.- Non
functional pads), you may end up taking many more (depending upon the layer count).  Use caution
though if you evaluate non functional pads (pads with no circuits connected).  These types of
pads are not "anchored" as well and may float, creating a potential for misinterpretation.
    Depending upon the stage that this board(s) is/are at, I would strongly suggest contacting
someone with Xray capability and have the boards checked.  Also, breakout is ok, but in what
direction is the breakout occurring and what type of connection do you have.   If you Email me
off line, I can talk a little more about "name brand" solutions,  I hope I didn't muddy the
situation worse for you.  JOHN WAITE

BOB HAYNES wrote:

> This question is in regard to inspection of internal annual ring. IPC
> 6012 Para. 3.4.2 allows breakout. When coupon F and/or X-ray
> techniques are not to be utialized and microsection is only option.
> How do you evaluate breakout?
>
> Thanks in advance for any suggestions.
>
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