TECHNET Archives

April 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Kathy Palumbo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Apr 1998 08:16:18 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (138 lines)
Eddie,

Here, here, I couldn't agree with you more!

The only problem I have with HASL is the board warpage issue.  It maybe okay
for .04" thick boards, but when you start getting down to the .015" thick
boards it does become a hassle (pardon the pun).

I am still in the process of looking at alternative coatings for our
product, and am currently evaluating the Silver Immersion coating.  I am
very pleased so far with some of the results I am getting, but still have a
ways to go.

Just my two cents.

Thanks,
Kathy Palumbo

> ----------
> From:         Eddie Brunker[SMTP:[log in to unmask]]
> Sent:         Friday, April 17, 1998 1:52 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] PWB Surface Finishes and Solderability Conference
>
> Thanks for the reply,
>
> I'm sorry for the abrassive manner with which I put my comments foward.
> I'm
> passionate about this industry, love the work etc..
> I feel there is too much misinformation in our industry though. It is
> generally related to having a product to sell.
>
> The new wonder finish is like the miracle way to loose weight without
> having
> to go on a diet.
> I'm aware that some OEMs have an issue with board finish.
>
> Consider the following scenario:-
>
> Manager/sales staff of OEM meets Manager of customer/design house.
>
> Yeah we can build that!
>
> Manager brings board back to Engineers and says we are going to build
> this.
>
> Engineer says the pad dimensions are totally inadequate we should have
> some
> input into the design stage to help the customer design his assembly for
> manufactuability.
>
> Manager says no, no, no! We might put our customer off if we did that.
>
> Decision is made to use flat finish to try to improve the adhesion of wet
> paste to the pad while printing, as there is such an inadequate pad
> dimension/geometry.
>
> The fact is if the product is designed with adequate pads then ordinary
> HASL
> finish does the job well.
>
> Unfortunately there is no drive to push design for manufacturability,
> probably because there is no company to benifit.
>
> We don't need a miracle cure, WE NEED EDUCATION.
>
> There is one major defect with HASL that is it's dome of solder. This
> presents us with no problems at 20 thou pitch on connectors, QFPs and
> SSOICs.
>
> Don't fall into the trap of trying to create flat HASL finish either. You
> run into other problems.
>
> The cleanliness aspect may be a factor for some too. But I'm sure this can
> easily be addressed by talking to the suppliers about the flux technology
> and cleaning methods.
>
> Thanks again,
>
>
>
> At 16:10 16/04/98 -0500, you wrote:
>
>  and yes, there was a bit of
> >HASL-bashing, but it was mainly done by the OEMs and assemblers, they are
> not finding
> >it to be acceptable.
>
> >I must tell you that no one is advocating HASL to me for the next
> generation of
> >surface mount PCBs. The conventional wisdom being (you might disagree)
> that
> the pads
> >are simply not planar enough. HASL's advantages and disadvantages are
> fairly well
> >understood, which may be another reason why no one wants to do a
> presentation on it
> >at my conference.
> >
> >
> >John Riley
> >Director of Education
> >IPC
> >2215 Sanders Road
> >Northbrook, IL 60062-6135
> >(pho) 847-509-9700 ext. 308
> >(fax) 847-509-9798
> >
> >
> >
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
> information.
> For the technical support contact Dmitriy Sklyar at [log in to unmask] or
> 847-509-9700 ext.311
> ################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2