1. BGA rework stations(manufacturers, avg cost, user friendliness)

We're using an Air-Vac DRS22 system.  It works well... we can successfully
remove and replace a 625 ceramic BGA (with Sn10 solder balls in the four
corners) from an 8 layer polyimide PWB which is bonded to a .150" thick silicon
carbide/aluminum matrix core.  It took quite a while to get a good
understanding of the programming procedure, but after you've done it a few
times, its pretty easy.  The operation to actually remove or replace a
component is somewhat easy, again, with practice.  Step by step instructions
are provided for the operator.  These instructions can be as simple or detailed
as you, the programmer, would like.  Air-Vac was very helpful and supportive in
the learning process, although this may have been geographic dependent.  (Their
in Connecticut and we're on Long Island, just a couple of hours drive.)  The
cost was approximately $40k.

2.  temperature profile of BGA reflow if differ from other types of
components(e.g. QFP, PLCC)

Since the solder joints for BGAs are under the device and not around the
periphery, longer soak times are usually requires to get these joints up to
proper reflow temperatures.  The thermal profile is easily established if you
have a spare assembly you can use to affix thermal couples.  One way to do it
is to drill a small hole up from the bottom of the PWB directly into a center
BGA solder ball, install a thermal couple and epoxy it in place.  This ensures
that the BGA will be instrumented properly.

3. X-ray inspection(what industry trends, if any, are currently being
used to inspect BGAs(100% x-ray inspection, little less, or none) , are
there facilities that will X-ray them for cost, and if so what is avg
cost..)

We perform x-ray inspection on 100% of BGAs for solder bridges.  Bridges
(solder shorts) are easily found with any x-ray system, opens are much more
difficult.  You may be able to distinguish between a good solder joint and an
open caused by a missing solder ball, but I've not come across any system which
can identify a cracked solder joint.  The EMPF ,Indianapolis, IN,
(317-226-5637) performs an x-ray service using their Four-Pi (I think its
Hewlett-Packard now) laminography system.  I don't know what they charge,
though.

Jim Marsico
AIL Systems Inc.
(516) 595-5879
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