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April 1998

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Subject:
3D inspection for BGA
From:
shigeoka <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Apr 1998 12:50:34 +0900
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text/plain
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text/plain (18 lines) 
I am looking for 3D inspection system to measure coplanarity of solder ball of BGA
before mounting to PWB.
There are two techniques, one is laser scanning, and another uses CCD camera.
I want to know merits and demerits of each technique.
Dose anyone have an experience of 3D inspection for BGA (or CSP).

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