Hi,
        anyone can tell me where to gather the assembly specification on the
BGA? I don't see the IPC pcb assembly spec stated any relevant criteria
on it. I'm interested in the misplacement, voids, ball diameter &
Z-height allowances.

        secondly, the BGA rework methodology, paste dispensing or micro stencil
printing for paste deposition. Which is the best solution?

Hope someone can provide the info.

Thks,
Alvin

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