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| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Thu, 16 Apr 1998 13:00:24 +0100 |
| Content-Type: | text/plain |
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At 13:23 15/04/98 -0500, you wrote:
>CALL FOR PAPERS
>IPC National Conference:
>
>Successful assembly operations begin at the finish¯the printed wiring board
finish!
>High density, fine pitch and unleaded component packages are useless if
they cannot
>be soldered to a reliable board surface.
IPC is sponsoring a two-day national event to bring the fabrication,
>assembly, OEM and supplier industries the latest information on what is
becoming the
>most critical link in today's sophisticated electronics.
>
May I ask is this the official IPC position regarding PCB finish?
Who is driving this push to alternative finishes?
Are fab houses/suppliers to the PCB industry going to benefit from this
helping hand?
Obviously there are no real vendors to gain from the promotion of HASL
finish, that boring old stuff which works fine for me, with fine pitch,
BGAs, 12 layers, 10,000 terminations etc...
>
>Maryellen Hilderbrand
>Education Manager
>IPC
>2215 Sanders Road
>Northbrook, IL 60062-6135
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Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
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