Chris,

Read your questions on TechNet . Here is our experience at Lockheed Martin OR&SS
in regards to No Clean:

        Question #1 : No Clean fluxes are allowable under the commercial
                      specifications J-STD-001, Requirements for Soldered
                      Electrical and Electronic Assemblies. No Clean flux material
                      is called out under J-STD-004. Not familiar with Def Stan 34-4.
                      J-STDs are Joint Industry Standards developed and endorsed by
                      EIA and IPC.

        Question #2 :   I participated in an Advance Research Projects Agency (ARPA) that
                        studied the use of No CLean Process in Assembly of Military SMT Cards.
                        This was completed 31Dec1995 under Contract # MDA972-93-C-0034 . We built
                        many circuit cards that were a mix of PWB material, conductor finish and
                        conformal coatings with a No Clean solder paste with no deleterious affects.
                        There were also studies done by Sandia National Labs and Georgis Tech around
                        the same time. An executive summary is available.

        Question #3 :   Not familiar with rosin flux fume restrictions.

I can be contacted by phone at (315) 456-1820 from 7:00 -3:30 PM EDST.

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