CALL FOR PAPERS
IPC National Conference:
A Summit on PWB Surface Finishes and Solderability
Embassy Suites Austin Airport/North, Austin, TX
September 24-25, 1998
Successful assembly operations begin at the finish¯the printed wiring board finish!
High density, fine pitch and unleaded component packages are useless if they cannot
be soldered to a reliable board surface. You can participate in the PWB industry's
only forum solely dedicated to advancements in the area of solderability and surface
finishing. IPC is sponsoring a two-day national event to bring the fabrication,
assembly, OEM and supplier industries the latest information on what is becoming the
most critical link in today's sophisticated electronics.
Papers are sought in all areas including:
· Innovations with alternative metals (Au/Ni, Pd,/Ni, etc.)
· Deposition processes
· Environmental impact
· Assembly-related issues
· Component lead to surface finish interactions
· Organic Solderability Preservatives (OSPs)
· Testing and analysis (SERA, Wetting Balance, etc.)
· End product requirements
· Reliability data
PRESENTATIONS:
Paper presentations at the conference may be thirty, forty-five, or sixty minutes in
length. Some presentations may be grouped together in a forum or panel discussion.
Papers and presentations must be non-commercial in nature, focusing on technology
rather than a company's product.
PROCEEDINGS:
Please note: It is mandatory to provide a print-quality paper or hard copies of
visuals for the conference proceedings in order to deliver an oral presentation. The
deadline for paper submission is September 4, 1998.
TO SUBMIT AN ABSTRACT:
Please fax your presentation title and a 200-300 word description along with a
biography to John Riley at 847/509-9798 or e-mail: [log in to unmask] Be sure to
include your full name, company, address, phone, fax and e-mail information. The
deadline for abstract submission is July 1, 1998.
COMPLIMENTARY CONFERENCE REGISTRATION:
Presenters at the 1998 IPC National Conference: A Summit on PWB Surface Finishes and
Solderability will receive full conference admission, including refreshments,
lunches, and the conference proceedings at no charge.
PROGRAM COMMITTEE:
Michael Carano, Electrochemicals, Inc.
Jim Reed, Texas Instruments
David Hillman, Rockwell International
Jim Langan, J.P. Langan & Associates
Peter Bratin, ECI Technology
Jack Geibig, University of Tennessee
Foster Gray, PC Interconnects
Larry Breeden, South Bay Circuits
Maryellen Hilderbrand
Education Manager
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Phone: 847.509.9700, ext. 382
Fax: 847.509.9798
E-mail: [log in to unmask]
URL: http://www.ipc.org
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################
|
