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April 1998

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Subject:
From:
RICK VERNON <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Apr 1998 07:44:14 -0500
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Please forgive the use of a competing (?) standard reference. We have a customer who is set on using the Lockheed Martin standards for acceptance of soldered assemblies. We are working with them to convert to IPC standards (with great hesitation on their part). The product is not military or medical. The product has many of the same requirements as automotive electronics.

I'm looking for advice or war stories on how this can be done with minimal gnashing of teeth for both sides. We currently work to IPC Class 2 for all products. However, we do meet IPC Class 3 the majority of the time, but we don't work to Class 3. Surface mount placement would be our biggest area for improvement to meet Class 3.

Thanks in advance.

Rick Vernon, Manager, QA
[log in to unmask]
(701) 277-6185

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