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April 1998

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Subject:
DES: IPC Land Patterns
From:
Steve Collins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Apr 1998 08:52:11 -0600
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text/plain (25 lines) 
A question has come up here that may have been answered before but could
not find specific reference in archives.

For chip resistors there is a note " If a more robust pattern is desired
for wave soldering devices larger than 1608 (0603, add 0,2 mm to the
Y-dimension, and consider reducing the X-dimension by 30%."

Does this go for all components or just the Chip Resistors.

Steve Collins
PCB Design Supervisor
Antec Corp.

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