Sheila:
- I haven't been around long enough to be an expert, but!
- Having been involved with WS-6536, Mil-S-45743, Mil-P-28809, DOD-STD-2000,
Mil-Std-2000, IEC-1191, J-STD-001 and other "high-rel" specs., I've never
heard of thermal cycling a connection after rework or repair.  The norm is
100% visual inspection of anything that has been reworked or repaired.
- Disclaimers which may apply include:  If your product is targeted for a
reliability growth development involving TAAF (an obsolete Test Analyze And
Fix program) you might have to conduct additional thermal cycling after repair
(not rework) or,     If 100% of your products are required by contract to
undergo environmental stress screening prior to delivery then you may need to
repeat the stress screening (that is normally only required when a component
has been replaced and is seldom if ever required for touch-up or rework of a
solder connection).  Usually, since the additional ESS or "burn-in" can
reasonably be expected to reduce operational life (so some say),  such
assemblies have to be identifed by serial number so the customer can track
them.
- I'm not familiar with the turnip truck (having never fallen off of one), but
perhaps if the light is bright enough you can see through the wool.
Regards, Jim Moffitt

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################