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April 1998

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Apr 1998 09:48:33 +1000
Content-Type:
text/plain
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text/plain (56 lines)
Sheila,
it is quite common on telecom boards , I used to do it on DDN boards ,
ages ago, let's hope one of Nortel guys can help you ; this subject 's
been quite well answered by them with relevant standards before .
Mind you they may be internal standards .
It's somewhere in the files .

paul

>----------
>From:  User[SMTP:[log in to unmask]]
>Sent:  Wednesday, 15 April 1998 6:39
>To:    [log in to unmask]
>Subject:       [TN] temp cycling of soldered assemblies
>
>TechNet -
>
>Is temperature cycling after solder rework a normal requirement?  I couldn't
>find anything in my copy of J-STD-001 addressing this, but I have a supplier
>telling me it's "always" done.  After temp cycling the solder joint is
>inspected again to see if it's still "okay"....???  I'm thinking this may be
>the old turnip truck trick, but I'm not sure.
>
>This is for proposed rework of a solder joint that was supposed to meet IPC
>J-STD-001A, Class 3.  The original solder was Sn96AWROL15 per J-STD-006.
>Thanks!
>
>Sheila Smith @ Tracor AES
>
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