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April 1998

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Subject:
Re: Voids
From:
MICHAEL DODSON <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Apr 1998 16:36:14 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines) 
Mike,

Thank you for you response to my inquiry. The answers to your
questions are listed below.

1.) After electroless / prior to tin
2.) Yes we do a backlight test and the Cu looks good.
3.) Yes, 70u".
4.) Both multilayers & double sided.
5.) Various times.
6.) No
7.) Resin and glass
8.) .040 + / vias are OK.

If you require more information, please let me know.

Sincerely,

Myke Dodson

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