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April 1998

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Subject:
From:
Paul Maciejewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Apr 1998 15:36:54 -0400
Content-Type:
text/plain
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text/plain (25 lines)
Tech netters,
I am in need of your great wealth of experience and enginuity. The problem
that I am experiencing is press fitting a solderless socket (Augat) into a
plated through holes that are .050 on center. We've tried baking the board,
using soap to eliminate friction and other imaginative ways of pressing
these sockets into the holes with limited success. Our problem is not
inserting the socket but, eliminating delamination from one hole location
to another. I believe that IPC-610 allows for a 25% delam, measling of the
pad. We are experiencing delam from hole to hole but not in all locations
just, a few.
Please, if any one has had this problem before I'd appreciate any feed
back.     Thanks, Paul

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