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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 13 Apr 1998 10:15:38 -0700 |
Content-Type: | text/plain |
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Jan,
I assume you will be using an edge conveyor through the reflow oven
otherwise you would not be concerned over sag. I suggest that you use a
reflow oven which has either a mesh belt conveyor (only in single sided) or
use a center support conveyor in conjunction with your edge conveyor (for
double sided and through hole boards).
If you would like to know who to talk to about center support and reflow
send me an e-mail offline at [log in to unmask]
Sincerely,
Brian Stumm
ETS, LLC
>hello,
>
>We would like to implement thinner printed circuit boards (pcb).
>Quoted price reductions are -4% for 1.2mm thickness and -6% for
>1mm pcb with respect to the standard 1.6mm boards.
>
>(Also the pcb weigth gets reduced).
>
>
>This sounds nice, however there were some remarks from our component
>assembly contracters: "thinner boards are less rigid". To be specific:
>
>-1- possible bending (and wobbling) of pcb during solder paste or
> adhesive dispensing
>-2- possible sagging of pcb in reflow and wave solder operations
>-3- problems with scoring of pcb
>
>I consulted Coombs' handbook, but could not find any answers.
>
>
>I do not doubt that others out there have been confronted with these
>same questions. As far as we understand it the only problem is with the
>assembly!
>
>Your comments is highly appreciated.
>
>Regards,
>
>Jan Vercammen
>
>PCB engineering Agfa-Gevaert
>
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