4/13/98

Dear Sir/Madam:

Greetings!  My name is Bernard P. Domingo, SMT Process Engineer from
EAI in the Philippines.  I've received your catalog and Iwant to thank
you for all that information.  In line with this, I'm going to make a
Project about Stencil Procedural Design, which will be our Company
Standard regarding Stencil Design.  This will touch matters regarding
correct aspect ratio, snap-off distance, and pad-to-apperture
measurements.  this project has the objective of eliminating or
minimizing defects such as solder balls and splashes.  Your help will
be very much appreciated.  If you could send me some information
regarding Stencil Procedural Design.

Hoping for your cooperation. Thank you very much and More Power!

Bernard P. Domingo
E-mail: [log in to unmask]

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