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April 1998

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Subject:
From:
TheITMTeam <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 10 Apr 1998 14:29:56 EDT
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Hey all -
Regarding articles on Paste-in-hole, Reflow of Through-hole (or whatever you
wish to call it) -
You can find the paper that Joe and I co-authored (a slightly later revision
of it) on my webpage under articles at www.ITM-SMT.com.  It is entitled Reflow
of Through-hole and it contains the formulas we worked up independently and
coinicidentally.
It also has the formula for double-sided reflow.  It previously appeared in
the Sept. '96 issue of Circuits Assembly.

I might also add, that in my experience, leads can protrude from the board,
but you should keep the protrusion under 0.050", with under 0.030" preferred.
Of course the paste should not dry out - it shouldn't anyway regardless of
whether you're doing Reflow of Through-hole or just good ol' SMT.  Also,
inserted components should have a stand-off of at least 0.012" above the
board.

In addition to our paper, you might also get a copy of Bill Barthell's
(Plexus) excellent work as well as that of Bob Willis of the SMART Group (UK).
Also Martha Rupert's article on AMP's webpage is another resource.

I share Kathy P's exhuberance for the process, too!

Regards,
Phil Zarrow
ITM, Inc.
Durham,. NH  USA
www.ITM-SMT.com

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