Jim,

     I don't know if you've ever heard of SMTPLUS, but they carry a TON of
different books that they sell that has everything and anything to do with our
industry...there's a LOT of very recent books there too. Go to:
WWW.SMTPLUS.COM     and then look under the listing of books that they carry.
Plus they publish the table of contents of each of the books so you can decide
whether you want them or not.

     You can pull up a list either by subject or by author. They have 2 books
that they sell that was written by a gentleman named David Frear. He published
them fairly recently too, one in 1993 and one in 1994...so they won't be
outdated.

     One is called; The Mechanics of Solder Alloy Interconnects", and the
other is "The Mechanics of Solder Alloy Wetting and Spreading". I'll paste the
table of contents in this email for both books so you can see if it's
something you might be interested in. For those of you that only have email
access, SMTPLUS's phone number is: (408) 438-6116. Jim Blankenhorn is the
company owner and a really good guy! He really knows his stuff, he's been
around this business for years! He primarily does training but carries a HUGE
line of very good reference books too.

                                                                              
I hope this will help ya...

                                                                              
-Steve Gregory-

The Mechanics of Solder Alloy Wetting and Spreading

The practical application of theoretical soldering principles to industrial
settings, this multi-disciplinary reference addresses the application of
solder to circuit connections, with special emphasis on the behavior of solder
media in the wetting process.

Breakdowns of advanced inspection technologies expedite assessment of solder
joint quality in electronic assemblies. Especially useful are the explanations
of new processes such as laser soldering and fluxless soldering that will be
needed to make the more complex assemblies of the future Advanced composite
solder alloys that improve reliability are also discussed.

Table of Contents

1- INTRODUCTION

2- SOLDERABILITY TESTING
•The Numbers Problem
•The Consistency Problem
•The Requirements Problem
•The Aging Problem

3- FLUXES and FLUX ACTION
•Flux History
•Flux Requirements
•Rosin-Based Fluxes
•Gaseous Fluxes
•Inorganic Fluxes
•Solderability Tests

4- REACTIVE WETTING & INTERMETALLIC FORMATION
•Analysis of Solder Spreading Kinetics
•Contact Line Motion Over Obstacles
•Metallurgy of the Moving Contact Line
•Thermodynamic Calculation of the Ternary Pb-Sn-Cu System
•Wetting Balance Studies on CU65N5 and CuSn

5- LOSS of SOLDERABILITY & DEWETTING
•Characterization of Dewetting
•Wetting Stability Diagrams
•Dynamics of Wetting Instabilities: Physical Mechanisms
•Intermetallic Formation

6- OXIDATION of SOLDER COATING
•Tin-Lead-Copper System Metallurgy
•Role of Oxides in Solderability Loss
•Tin-Lead Oxidation
•Solderability Assessment Via Oxides
•Accelerated Aging



7- SURFACE & INTERFACE ENERGY MEASUREMENTS
•Basic Concepts
•Equilibrium Conditions for a Curved Interface
•Capillary Effects in Solids
•Experimental Techniques

8- ADVANCED SOLDERING PROCESSES
•Impetus for Change
•Alternative Approaches to Promote Wetting
•Alternative heat Sources
•Solder Bump Technology
•Future Directions for Solder Process Technology

9- RELIABILITY-RELATED SOLDER JOINT
•Motivation
•Inspection Criteria
•Inspection Technologies
•Mantech/ADSP Solder Joint Inspection
•Inspection Automation
•Advanced Solder Joint Inspection Techniques

10- THE PROPERTIES of COMPOSITE SOLDERS
•Mechanics of Solder Joints
•Alloy Design for Thermomechanical Fatigue Resistance
•Methods of Producing Composite Solder Alloys
•In-Situ Composite Solder by Rapid Solidification
•Properties of Composite Solder Alloys

Price: $87.95

Authors: D. Frear, M. Hosking & F. Yost

Printed: 1993 ISBN#: 0-442-01752-9

Availability: Stock



The Mechanics of Solder Alloy Interconnects

From innovations in basic science to automated assembly and inspection lines,
all the critical information and advice is found in this comprehensive and
highly advanced survey of solder joints in electronic applications.

As the trend toward the increased miniaturization of devices continues, solder
interconnects are being the limiting factor in the reliability of electronic
packages. With the critical nature of these small electrical-mechanical
interconnections, the question arises: Just how reliable are the solder joints
in a modern electronic package? The book will answer the question by
addressing the materials and mechanics issues associated with solder joints in
this state-of-the-art assessment.

Table of Contents

1- INTRODUCTION

2- MICROSTRUCTURAL INFLUENCES on the MECHANICAL PROPERTIES of SOLDER
•Solder Microstructures
•The Influence of Microstructure on Mechanical Properties

3- INTERFACES and INTERMETALLICS
•Intermetallics in the Solder Joint
•Effect of Intermetallics on the Integrity of Solder Joints
•Recent Advances in Microstructural Analysis of Intermetallics

4- CONSTITUTIVE MODELS
•Constitutive Modeling From a Materials Perspective
•Theoretical Aspects of Constitutive Modeling

5- PREDICTION of SOLDER JOINT GEOMETRY
•Objectives
•Soldering Methods
•Surface Tension Theory
•Models for Predicting Solder Joint Geometry
•Future Research Needs

6- LIFE PREDICTION and ACCELERATED TESTING
•Life Prediction
•Life Prediction Approaches
•Coffin-Manson LCF Approach
•Integrated Matrix Creep Strain Approach
•Energy Approaches for Fatigue Life Prediction
•Engelmaier Reliability Model
•Crack Propagation Approaches
•Influence of Comparison and Microstructure
•Isothermal, Thermal, and Thermomechanical Fatigue

7- THERMOMECHANICAL MODELING of SOLDER JOINTS- NUMERICAL CONSIDERATIONS
•Purpose of Numerical Modeling
•Boundary Value Representations of Physical Problems

8- APPLICATIONS- THROUGH HOLE
•Modeling Considerations
•Examples

9- SURFACE MOUNT SOLDER JOINTS UNDER THERMAL, MECHANICAL AND VIBRATION
CONDITIONS
•Fine Pitch TSOP Solder Joints Under Thermal Conditions
•Fine Pitch Large QFP Solder Joints Under Bending and Twisting Conditions
•Surface Mount Connector Solder Joints Under Vibration Conditions

Price: $82.50

Authors: D. Frear & S. Burchett

Printed: 1994 ISBN#: 0-442-01505-4

Availability: Stock 


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