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April 1998

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Subject:
From:
Jan Vercammen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Apr 1998 15:48:34 +0200
Content-Type:
text/plain
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text/plain (44 lines)
hello,

We would like to implement thinner printed circuit boards (pcb).
Quoted price reductions are -4% for 1.2mm thickness and -6% for
1mm pcb with respect to the standard 1.6mm boards.

(Also the pcb weigth gets reduced).


This sounds nice, however there were some remarks from our component
assembly contracters: "thinner boards are less rigid". To be specific:

-1- possible bending (and wobbling) of pcb during solder paste or
    adhesive dispensing
-2- possible sagging of pcb in reflow and wave solder operations
-3- problems with scoring of pcb

I consulted Coombs' handbook, but could not find any answers.


I do not doubt that others out there have been confronted with these
same questions. As far as we understand it the only problem is with the
assembly!

Your comments is highly appreciated.

Regards,

Jan Vercammen

PCB engineering Agfa-Gevaert

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