----------
From:  Mike Johnson
Sent:  Tuesday, April 07, 1998 11:11 AM
To:  Mike Johnson
Subject:  FW: IPC Test methodes



----------
From:  Mike Johnson
Sent:  Tuesday, April 07, 1998 9:09 AM
To:  [log in to unmask]
Subject:  IPC Test methodes

Greetings to all,
I have a question on the IPC-TM-650 test methods book. In section 2.1
visual, under 2.1.4 solder examination. This was printed as planned for
future release. Does anyone have any information on this subject?  The
actual question I am trying to answer is as follows. Is there a minimum
and maximum allowable solder coating thickness for surface mount pads?
Also is there a surface insulation resistance specification?  Thanks for
your time in advance.

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