My experience is solder wicks around the lead regardless of the shape of the
pad. The extra solder paste possible by having square apertures (on square
pads) in the stencil is also welcome.

>It is preferred to have oblong lands to assist in concentrating the solder
fillet
>around the component lead. The IPC-SM-782 indicates oblong as optional but
should
>read preferred.
>
>Regards,
>
>
>Gary Ferrari

A complex PCB (PWB) let's say 1500, 2000, 10,000 nodes, there is no way the
layout comes down to ONE last 8 mil trace. Come on guys, there must be loads
of you dealing with assemblies at this level, you know this statement isn't
true. Modern complex assemblies aren't even tracking on the surface layers.

We use square pads all the time, deal with nodes counts as above with high
density. No problems.


At 23:31 31/03/98 -0500, you wrote:
>It helps when they are oblong and rounded when it is high density smd and
yes Virginia it does
>stack up and if you use square pads, it will prevent that last 8 mil trace
from fitting.
>
>"I drank WHAT?"
>
>-Socrates....
>
>
>
>
>
>Marletta Tucker wrote:
>
>> What is the deciding factor on whether or not an SMD parts land is
squared off
>> or oblong?  Could/should all SMD parts have oblong lands?
>>
>>   @ @ @                 Thanks,
>> @ @ @ ///
>>  @    *                 Marletta Tucker
>> @ @    >                1921 Hurd Dr. M/S 2-21
>> @@|\ _                  Irving, Tx. 75038
>> @ |                     972-518-7619
>>   #                     [log in to unmask]
>>
>> We have enough youth, how about a fountain of SMART?
>>
>> The above views are my own, and do not represent those
>> of Abbott Laboratories.
>>
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