We are experiencing a problem with voids. The void issue tends to be
on one end of the panel only, this end of the panel is towards the
bottom of the electrolytic copper tank when plated. Voids have
occurred on 4 different jobs all cuposited and plated on the same
day, but not all the panels had voids and other orders went thru
without voids. All chemistries were analyzed and found to be in spec.
During this time period we believe that the void issues are
mechanical. Low temp in cuposit or poor re-circulation due to pump
problems. Any suggestions on what other items should be checked?


Michael Dodson
Product Engineer
SBC Inc.

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