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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 17 Apr 1998 12:40:33 +0100 |
Content-Type: | text/plain |
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At 21:46 16/04/98 -0500, you wrote:
>
>
>
>
>Hi TechNet -
>
HASL finishes are quite
>robust in many assembly operations but can be equally non-robust in other
>assembly operations.
It would be useful to have a discussion on the specific situations where
this is the case.
In addition there are a number of IPC committees (e.g.
>ANSIJ-STD-002/003, and the Alternative Solderable Finishes task group) that
>have an active interest in the latest developments in the alternative
>finishes activities.
I agree that we must look to the future. But why look for complex answers
when simple ones already exist.
As stated earlier, education may hold the key, but that's not as exciting or
glamorous as a new PCB finish.
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
P.S. Again, please excuse any illmannered ranting and raving on my part earlier.
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