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Reply To: | DesignerCouncil E-Mail Forum. |
Date: | Tue, 21 Apr 1998 12:02:20 +0100 |
Content-Type: | text/plain |
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We have a small docking PCB with four contact pads, plated with
electrolytic gold. The pins which make contact with the pads are quite
sharp and after a period of time are penetrating the gold, through the
copper and into the FR4. To prolong the time I have suggested making the
gold and copper thicker, but is any body aware of alternative materials
to hard gold and/or copper that would be suitable for this kind of
application ie something that would provide a harder contact surface.
Any suggestions would be extremely welcome.
Thanks in advance,
Adam Hawes (GenRad Ltd)
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