Bill
     I recently attended a seminar on "Chip Scale Packaging" at Xetel Corp
     in Austin, Texas. Xetel is a BGA and CSP assembly house.
     Intel was also there and they were giving out a "Comprehensive User's
     Guide for uBGA Packages" It contains a good amount of information for
     both design and manufacturing. You can down load a copy from Intel's
     web site (http//developer.intel.com/design/flcomp/packdata/)

     You might also want to check out Xetel Web site WWW.xetel.com

     With the fine pitch devices the need for microvias is a good
     possibility. A company that does "Photo Defined Vias" (PDV) was also
     at the seminar. MicroVia has a Web site at WWW.MicroVia.com.

     We have not built any boards yet with BGA or CSP. The day will come
     soon I believe.

     Good luck
     Tim Kaste
     Syntron Inc.
     Houston, Texas


______________________________ Reply Separator _________________________________
Subject: [DC] Chip Scale Packaging
Author:  [log in to unmask]>                "Brown  William G"
<[log in to unmask] at INTERNET_MAIL
Date:    4/8/98 5:14 PM


Hi all,

I finally break my silence..(well except for a few mis-sent listserv
messages.... :)

I work with advanced packaging concepts and we are looking at taking
several Chip Scale
Packages (pkgs only approximately 20% larger than the bare die
themselves) and placing them
on a small prototype circuit board.  These CSP packages have 20-mil
pitch uBGA balls as I/O
and I'm curiously concerned about the ability to place these devices on
a circuit board with the
fine pitch. I was wondering if anyone could comment on any of their
experiences with CSP
packages, particularly from an I/O pitch, reliability or production (low
quantity) feasibility aspect.

Basically, I'm just looking for a better understand of what's been done
with CSPs, what
potential problems might be encountered in using them and what level of
PCB technology is
needed to accommodate these devices.

Thanks,
Bill

        William G. Brown
        MCMs & Electronic Packaging
        Sanders, A Lockheed Martin Co.
        PH (603) 885-3704  FX -7623
        =-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=
        Through the door of endless time
        We fall beyond the burning sky
        Like clouds that ever sink behind
        The crimson horizon's fading line

################################################################
DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text
in the body:
To subscribe:   SUBSCRIBE DesignerCouncil <your full name>
To unsubscribe:   SIGNOFF DesignerCouncil
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or
847-509-9700 ext.311
################################################################

################################################################
DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE DesignerCouncil <your full name>
To unsubscribe:   SIGNOFF DesignerCouncil
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################