Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 6 Apr 1998 14:27:02 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
From IPC-6012:
3.2.6.6 Gold Plating-- Electrodeposited gold plating shall be in accordance with
MIL-G-45204. Class and Type shall be specifed on the procurement documentation. For
Class 3 boards, gold plating shall be Type II or III Class 1.
Table 3-2, Final Finish, Surface Plating Coating Requirements
Gold (min) for edgeboard connectors and areas not to be soldered: Class 1, 0.8 um;
Class 2, 0.8 um; Class 3, 1.3 um.
Gold (max) on areas to be soldered: Class 1, 0.8 um; Class 2, 0.8 um; Class 3, 0.8
um.
Lisa Williams
IPC
2215 Sanders Road
Northbrook, IL 60062
URL: www.ipc.org
>>> <[log in to unmask]> 04/06/98 01:01PM >>>
Can anyone refer the document that states proper wording of a gold
over nickel finish?
Thanks
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################
|
|
|