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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 24 Apr 1998 11:10:16 +0300 |
Content-Type: | text/plain |
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clarissa wrote:
> Hello People,
>
> Is there any other method of detecting smears in
> T/Hs aside from subjecting the boards to
> solder dipping and microsection?
>
> Any information about this query will be very
> much appreciated.
>
> Clarissa Magat
>
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Hi,TechNetters!
I am confused about the need to perform solder dip in order to detect
SMEAR.
I think that there is no problem in detecting SMEAR in any process step
after hole copper
plating.On the contrary-after solder dip you have to think and look
twice in order to be sure
that you are dealing with SMEAR and not POST SEPARATION-or you name it.
Comments are very appreciated.
Thank you,
Gaby
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