Hello all,

Our standard solderability test for HASL or Reflowed Tin-Lead finish is
5 seconds at 235 C (455 F) using non-activated SM/NA Flux on a static
solder bath. We are seeing odd instances of missed pads on Electroless
Nickel/Immersion Gold finish where the solder has not touched the pad at
all.

This only occurs on random isolated pads, sometimes one in a row of SMD
pads, and I am wondering whether the test parameters should be slightly
different for this finish or if there is a problem with the test rig.
The majority of pads have tinned and solderability on these is very
good.

Any input on test parameters used elsewhere would be appreciated.

--
Paul Gould
[log in to unmask]
Isle of Wight,UK

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################