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April 1998

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Subject:
From:
Chetan Shah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Apr 1998 22:27:37 +0000
Content-Type:
text/plain
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text/plain (21 lines)
Tom:

Companies such as CMI  have equipment that use eddy current
method to measure copper thickness in holes. I believe the minimum
hole dia has to be 0.030 and minimum substrate thickness has to be
0.031.

Chetan Shah

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